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DirectLaser S3 series- Precise laser cutting system

DirectLaser S3 adopts dual-table design, which saves the loading and unloading time, and keeps the laser always in the processing state. The processing area of S3 is 350mmx500mm, which is suitable for depaneling placed PCBs, open cover film window and other processes in SMT industry. It can also be equipped with camera target pre-positioning system, saving the processing time due to target positioning.


Features

Directly data driven

Driven directly from customer data, fast product turnaround

High level automation

Conveyor feeder option allows for easy integration into assembly lines

Break through mechanical limits

Laser cutting replaces dies avoiding distortion and breaking through mechanical limits

Precise laser control

Precise, deep and micron-scale structure operation

Cold cutting with picosecond Laser

Cold cutting with picosecond laser has no thermal effect and expands machinable materials

Product parameters


Technical data

DirectLaser S3

Laser power

15W (±2W)

Laser wavelength

355nm

Working area

350mm x 500mm  (Double platform)

Platform

Granite table and linear motor

X/Y/Z resolution

1μm

Repetitive accuracy

≤±2μm

Data processing software

CircuitCAM 7 Standard

System operating software

DreamCreaTor 3

Automatic feed

Optional

Automatic CCD camera fiducial positioning

Optional

Exhaust unit

Optional

Dimension(W x H x D)

1,600mm x 1,600mm x 1,950mm

Weight

2,500kg

Power requirements

380VAC/50Hz,3.5kW

Operation temperature

22℃±2℃