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DirectLaser S2 series- Precise laser cutting system

High-precision, high-quality, the new standard for small-format equipment.


With the rapid advancement of electronic technology, designers are creating increasingly denser, smaller, thinner, and more irregular boards crating a challenging depaneling environment. DCT provides a more environmentally friendly, fast, precise and reliable solution to meet the needs of this trend.


Stress less

With laser cutting even if the components are very close to the cutting path, no stress is imparted to nearby components.


Accurate control of thermal effects

According to the thermal requirements lasers are selected to match the laser processing parameters to minimize the thermal impact.


Clean processing

Exhaust of gases and laser ablation byproducts is performed in real time during processing to minimize the impact of contamination on components.



Features

Directly data driven

Driven directly from customer data, fast product turnaround

High level automation

Conveyor feeder option allows for easy integration into assembly lines

Break through mechanical limits

Laser cutting replaces dies avoiding distortion and breaking through mechanical limits

Contact free processing

Material is removed using laser light, no contact made with PCB panel eliminating stress damage

Precise laser control

Precise, deep and micron-scale structure operation

Product parameters

Technical data

DirectLaser S2

Working area

350mm x 300mm

Platform

Granite table and linear motor

X/Y/Z resolution

±2μm

Reapetative accuracy

±2μm

Data processing software

CircuitCAM 7 Standard

Machine software

DreamCreaTor 3

Automatic feed

Optional

Camera postitioning

Optional

Exhaust unit

Optional

Dimension(W x H x D)

890mm x 1,630mm x 1,150mm

Weight

Approx. 600kg

Power requirements

380VAC/50Hz,2.4kW

Ambient temperature

22℃±2℃